Printed Circuit Board Manufacturing - Multilayer Flexible Circuit Board
Production is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.
We can manufacture from 3 to 8 layers. Typically, with multilayer flex circuits, as the number of layers increases, the thickness also increases, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.
- 企業：ケイツー
- 価格：Other
